Re: [Qemu-devel] [RFC 2/5] hw/arm: add very initial support for Canon DIGIC SoC

[Antony Pavlov]

On Fri, 30 Aug 2013 15:07:49 +1000
Peter Crosthwaite <address@hidden> wrote:

> Hi,
> 
> 
> On Fri, Aug 30, 2013 at 6:16 AM, Peter Maydell <address@hidden> wrote:
> >
> > On 29 August 2013 20:36, Antony Pavlov <address@hidden> wrote:
> > > On Thu, 29 Aug 2013 14:15:40 +0200
> > > Andreas Färber <address@hidden> wrote:
> > >> DigicState should be a QOM type derived from TYPE_DEVICE. Since you're
> > >> hardcoding the CPU type, please use object_initialize() to create it
> > >> in-place - note we're about to extend that function but rebase will be
> > >> trivial.
> > >
> > > I have just examinied platforms with hardcoded cpu: pxa2xx, exynos4210.
> > > They don't use object_initialize().
> >
> > You'll find that QEMU is full of old code that hasn't been updated
> > to the current "best practice". pxa2xx in particular is pretty elderly
> > and probably a bad example to copy from. object_initialize()
> > is pretty new, which is why you can't find many examples yet.
> >
> > >> Is the RAM on the board or on the SoC? It's in DigicState but
> > >> initialized from the board init. If it's on the SoC, then
> > >> _add_subregion and _register_ram_global should be in its realizefn.
> > >> Otherwise please separate it from the SoC state.
> > >
> > > It's not a trivial question!
> > > See "Digging Into 'DIGIC 4' Image Processor (2)" 
> > > (http://techon.nikkeibp.co.jp/english/NEWS_EN/20090218/165866/).
> > > The authors removed the upper package with a chemical solution and 
> > > exposed the chips.
> > > The 'DIGIC 4' contains 3 chips in one package:
> > >  * processor itself;
> 
> For clarity, do you mean SoC here?
> 
> >
> > >  * 64-Mbit NOR flash memory, the "K8P6415UQB" (note that I have found 
> > > another flash K8P3215UQB on my Canon A1100: Manufacturer ID: 0xEC, Device 
> > > ID: 0x7E0301);
> > >  * 512-Mbit SDRAM, the "K4X51323PE" (just the same 64 M RAM as I see with 
> > > barebox).
> > >
> > > So we can assume taht these memory chips are inalienable parts of the SoC.
> >
> > Package-on-Package is really just a funky way of connecting
> > up separate components (the layers are only connected
> > together at PCB assembly time, wikipedia tells me), and
> > indeed you can have different component combinations
> > (as you've found with the flash memory). So I would suggest
> > that either:
> >  (a) just model them all as separate components
> >    (SoC, memory, flash) instantiated by the board
> >  (b) model them as separate components, and have a
> >    "container" component which puts them together and
> >    then the board just instantiates that.
> >
> > Whether (b) is worthwhile depends on whether we
> > expect to have lots of boards that differ but have the
> > same PoP stack. I suspect (a) is better.
> 
> I like (b). If something is sold, branded or soldered as a self
> contained package then I think its worth having its own device. FWIW,
> I want to do this with Zynq sooner or later as its a SoC that's
> modelled as a board.

The current RFCv1 patch series tends to (a). So I'll keep this till RFCv2 code 
review :)

-- 
Best regards,
  Antony Pavlov